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1

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Miniaturization and Optimization of RF SAW Filter Using Wafer Level Packaging Technology

Kim, Tae Hoon, Jeung, Won Kyu, Yang, Si Joong, Choi, Seog Moon, Park, Seung Wook, Kim, Hyun Ho, Ha, Job, Park, Mi Jin, Kao, S., Hong, J.P., Yi, Sung, Hwang, Jun Sik, Lim, Ji Hyuk, Kim, Woon Bae

Year:

2007

Language:

english

File:

PDF, 3.51 MB

english, 2007

2

[IEEE 2008 2nd Electronics Systemintegration Technology Conference - Greenwich (2008.09.1-2008.09.4)] 2008 2nd Electronics Systemintegration Technology Conference - Fabrication and optimization of wafer level SAW filter package using laser via drilling

Seung Wook Park,, Ju Pyo Hong,, Tae Hoon Kim,, Si Joong Yang,, Job Ha,, Tae Ho Kim,, Sang Wook Park,, Young Do Kweon,, Sung Yi,

Year:

2008

Language:

english

File:

PDF, 15.06 MB

english, 2008

3

[ECS ISTC/CSTIC 2009 (CISTC) - Shanghai, China (March 19 - March 20, 2009)] ECS Transactions - Wafer Level SAW RF Filter Packaging With Through Wafer Via Interconnection

Kweon, Youngdo, Park, Seungwook, Kim, Taehoon, Honh, Jupyo, Yang, Sijoong, Ha, Job, Kim, Taeho, Yi, Sung

Year:

2009

Language:

english

File:

PDF, 295 KB

english, 2009

4

Estimation of clamping force in high-tension bolts through ultrasonic velocity measurement

Kyung-Young Jhang, Hai-Hua Quan, Job Ha, Noh-Yu Kim

Journal:

Year:

2006

Language:

english

File:

PDF, 646 KB

english, 2006

5

Wavelet analysis based deconvolution to improve the resolution of scanning acoustic microscope images for the inspection of thin die layer in semiconductor

Kyungyoung Jhang, Hyoseong Jang, Byungil Park, Job Ha, Ikkeun Park, Kyungsuk Kim

Journal:

NDT & E International

Year:

2002

Language:

english

File:

PDF, 1.09 MB

english, 2002

6

[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - Reliability evaluation of semiconductor using ultrasound

Hyoseong Jang,, Job Ha,, Kyungyoung Jhang,, Joonhyun Lee,

Year:

2001

Language:

english

File:

PDF, 899 KB

english, 2001

7

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Novel substrate technology for IPM (intelligent power module) applications: Structural, thermal and electrical characteristics

Kwang-Soo Kim,, Young-Ki Lee,, Young-Hoon Kwak,, Ji Hyun Park,, Job Ha,, Ga-Young Shin,, Bum-Seok Suh,

Year:

2012

Language:

english

File:

PDF, 460 KB

english, 2012

8

Ultrasonic Estimation of Clamping Force in High-Tension Bolts

Jhang, Kyung Young, Quan, Hai Hua, Ha, Job, Kim, Noh Yu

Journal:

Key Engineering Materials

Year:

2006

Language:

english

File:

PDF, 436 KB

english, 2006

9

ECS Transactions [ECS 218th ECS Meeting - Las Vegas, NV (October 10 - October 15, 2010)] - The Impact of Helium Co-Implantation on Hydrogen Induced Donor Profiles in Float Zone Silicon

Laven, Johannes, Job, Reinhart, Schulze, Hans-Joachim, Niedernostheide, Franz-Josef, Häublein, Volker, Schulze, Holger, Schustereder, Werner, Ryssel, Heiner, Frey, Lothar

Year:

2010

Language:

english

File:

PDF, 1.30 MB

english, 2010

10

ECS Transactions [ECS China Semiconductor Technology International Conference 2011 (CSTIC 2011) - Shanghai, China (March 13 - March 14, 2011)] - MUF Technology Development for SiP Module

Kweon, YoungDo, Ha, Job, Kim, KiChan, Jang, MinSeok, Doh, JaeCheon, Lee, ChangBae, Yoo, Dojae

Year:

2011

Language:

english

File:

PDF, 551 KB

english, 2011

11

Detection of Micro-Delamination in Electronic Packaging by Using the Ultrasonic Nonlinearity

Jhang, Kyung Young, Ha, Job, Jang, Hyo Seong

Journal:

Key Engineering Materials

Year:

2004

Language:

english

File:

PDF, 577 KB

english, 2004

12

Detection and Image Processing of Interfacial Micro-Delamination in the Thin-Layered Structure by Using Nonlinear Ultrasonic Effect

Ha, Job, Jhang, Kyung Young

Journal:

Key Engineering Materials

Year:

2006

Language:

english

File:

PDF, 382 KB

english, 2006

13

Nonlinear Ultrasonic Method to Detect Micro-Delamination in Electronic Packaging

Ha, Job, Jhang, Kyung Young

Journal:

Key Engineering Materials

Year:

2005

Language:

english

File:

PDF, 279 KB

english, 2005

14

Advanced Technologies for Estimation of Nonlinear Ultrasonic Parameter

Jhang, Kyung Young, Sasaki, Kimio, Ha, Job, Tanaka, Hiroaki

Journal:

Key Engineering Materials

Year:

2006

Language:

english

File:

PDF, 448 KB

english, 2006

15

Does Changing Inhaler Device Impact Real-Life Asthma Outcomes? Clinical and Economic Evaluation

Rhee, Chin Kook, van Boven, Job F.M., Yau Ming, Simon Wan, Park, Hye Yun, Kim, Deog Kyeom, Park, Hae-Sim, Ling, Joanna Zhi Jie, Yoo, Kwang-Ha, Price, David B.

Journal:

The Journal of Allergy and Clinical Immunology: In Practice

Year:

2018

Language:

english

File:

PDF, 559 KB

english, 2018